As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

UMC's 3D IC solution for RFSOI reduces circuit footprint by more than 45%, enabling integration of more RF components in 5G-enabled devices. UMC's innovative 3D IC technology addresses the challenge ...

What design considerations are there for 3D IC packaging? How do issues like thermal design differ with 3D IC packages? 3D IC ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as Co-Packaged Optics, including ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs.

The Industrial Technology Research Institute (ITRI) has partnered with microcontroller unit (MCU) manufacturer Generalplus to develop a wireless oral sensing capsule for medical inspection services.

Developing economies do not have to invest billions of dollars in state-of-the-art fabs to get into the semiconductor industry, according to Sadeg Faris, chairman and chief executive officer of Reveo ...