Daktronics has released its Flip-Chip COB (Chip On Board) LED display technology. The latest addition to its Narrow Pixel Pitch (NPP) product family brings tighter pixel spacings ranging from ...

Glob top encapsulations are often preferred for their ability to protect chips without damaging fragile wires. They are formulated to exhibit specific physical properties such as electrical insulation ...

South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry's first dual-function BOC COB Bonder, capable of performing both Board-on-Chip (BOC) ...

Sharp Electronics of Canada Ltd. unveiled its EC Series dvLED, which delivers improved visual performance, simplified installation and enhanced energy efficiency, powered by advanced Chip-on-Board ...